KB-6167F，高TG無(wú)鉛環(huán)氧覆銅板采用優(yōu)質(zhì)玻璃纖維布及環(huán)氧樹脂經(jīng)特別工藝壓制而成，擁有較高的TG值,TG170可使它在更加高的溫度中工作．

特性：

●?Tg 170(DSC 測(cè)試),低Z軸 CTE值  Tg 170℃ (DSC Testing),low Z-axis expansion

●?相容紫外光阻擋及光學(xué)自動(dòng)檢查功能,可提高PCB生產(chǎn)效率與準(zhǔn)確性 UV Blocking and AOI (automatic optical inspection) compatible， so as to increase
productivity and accuracy

● 熱裂解溫度高 High Thermal Delamination
● 優(yōu)良的耐熱性,能滿足無(wú)鉛制程要求 Excellent heat resistance and appropriate for lead-free assembly

●?符合IPC-4101B的規(guī)范要求?IPC-4101B?specification?is?applicable

應(yīng)用領(lǐng)域：

●計(jì)算機(jī)及外圍設(shè)備  Computer and peripheral

●通訊設(shè)備 Communication equipment

●儀器儀表 instrument

●辦公自動(dòng)設(shè)備 OA equipment,etc

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